When to Use Heat Resistance of PI Advanced Materials？

PI Advanced Materials (PIAM)'s polyimide (PI) materials have excellent heat resistance and are suitable for use in extreme temperature environments. The following are the main features of its heat resistance:

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Heat resistance characteristics

High temperature stability: Polyimide materials are able to operate at temperatures up to 400°C or above, and some types of polyimide can even be used for a long time at 450°C. This feature makes it particularly important in the aerospace and electronics industries.
 

Initial decomposition temperature: The initial decomposition temperature of PI materials is usually higher than 400°C. For example, the 5% and 10% decomposition temperatures of some polyimide films are 501-506°C and 510-514°C, respectively.
 

Glass transition temperature (Tg): The glass transition temperature of PI materials is also relatively high, usually exceeding 300°C, for example, some types of polyimide can reach 487°C. This high Tg value helps maintain the mechanical properties and dimensional stability of the material at high temperatures.
 

Wide range of applications: Due to its excellent heat resistance, polyimide is widely used in fields that require high temperature resistance, such as aerospace, microelectronics, liquid crystal display, etc.

These heat-resistant properties make PI Advanced Materials' polyimide materials an ideal choice in many high-tech applications.

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What is Polyimide?

Polyimide (PI) is a unique family of ultra-high-temperature polymers containing imide linkage. PI has gained recognition for its material performance properties required for the highest demanding environments such as dimensional stability, heat resistance, chemical resistance and electrical insulation. PI can withstand extreme temperatures ranging from near -270℃ to above 400 ℃. Polyimide plays a crucial role in the electronics and aerospace industry because of its dimensional stability, electrical properties and flexibility. By integrating advanced polyimide materials into their core, industries are accelerating into the future, crafting technology that not only meets the demands of tomorrow.

Arkema acquires majority stake in PI Advanced Materials

In December , Arkema acquired a controlling stake in PI Advanced Materials. Polyimide-based materials broaden Arkema’s polymer range with ultra-high performance and cutting-edge technology. With more than 30% global market share, PIAM, based in South Korea, is the global leader of polyimide films for flexible printed circuit boards and graphite sheets used in the high growth and high margin markets of mobile devices and electric vehicles.

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Enriched portfolio, global team 

As PI Advanced Materials becomes an Arkema affiliate, the strong synergies driven by product ranges and geographic complementarities between the two companies open doors for new customer experiences in the world of ultra-high-temperature polymers.

With the new enriched portfolio of advanced polymers integrating polyimide high-performance polymers, our global team is ready to provide you with support in your project. 

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