Semiconductor Sputtering: What Is This Process And Why Is It Used?

Semiconductors undergo numerous processes to become functional for various applications. Sputtering is a technique used across many industries, but what exactly is it and why is it employed?

Specifically, semiconductor sputtering is a method to deposit thin films of material onto a substrate. This process finds application in creating device contacts, forming resistors and capacitors, and manufacturing transistors. Let's delve deeper into semiconductor sputtering and explore its significance in the semiconductor fabrication process.

What Is Sputtering?

Sputtering involves ejecting surface atoms of a solid target material, shifting them from their solid phase to a gas phase after bombardment by energetic ions. For sputtering to occur, the kinetic energy of the incident ions must exceed the target surface binding energy. This physical vapor deposition technique results in a thin film and coating on the target material or “substrate,” most often within a vacuum chamber. The average number of target atoms ejected per incident ion is the sputter yield.

In simpler terms, this process entails bombarding a material with high-energy particles like plasma or inert gas. The collision leads to particles being ejected from the solid material's surface. Conventional thermal energies should be lower than the ion bombardment leading to this ejection. While this process can occur naturally in outer space, humans have adapted it for various applications on Earth.

Different types of sputtering include DC sputtering, magnetron sputtering, reactive sputtering, and RF sputtering. Sputtering on thin film materials has enabled the fabrication of numerous devices and equipment, from nanotechnology materials to optical material coatings and semiconductor devices.

The Sputtering Process In The Semiconductor Industry

In the semiconductor industry, sputtering target materials are essential for several processes, including wafer fabrication, which addresses the wafer's conductive and barrier layers. The sputtering process is also pivotal in semiconductor chip packaging.

Primary sputtering methods include ion beam sputtering and reactive sputtering. But why is sputtering so vital for semiconductors?

The Importance Of Sputtering Targets For Semiconductors

Advancements in technology and increasing consumer demands for lightweight devices with lower power consumption and better processing capabilities mean that sputtering techniques and targets in semiconductor fabrication need to improve these characteristics.

Sputtering is critical in both wafer fabrication and chip packaging. Semiconductors are sensitive devices that require high purity for both water and chip production due to the ease of particle formation on their surfaces. Thus, the quality of sputtering target material must be exceptionally high, often 99.999% (5N5) or purer.

The effectiveness of the sputtering process is directly linked to the quality of the metal target materials. High-quality sputtering target materials ensure uniformity and conductive capabilities of the conduction and barrier layers, impacting the momentum transfer and stability of chip transmission.

Sputtering Target Materials For Semiconductors

Various elements serve as sputtering target materials bombarded by high-energy particles. These elements come in different purities and forms, such as monoblocks and compounds of varying sizes. They also use various cathode materials and undergo different mounting methods. Each sputtering target is suitable for specific sputtering target systems with particular coating materials.

Some sputtering target elements include:

• Aluminium
• Chromium
• Copper
• Gold
• Molybdenum
• Nickel
• Niobium
• Palladium
• Platinum
• Quartz
• Silicon
• Silver
• Titanium
• Tungsten

The Drawbacks Of Semiconductor Sputtering/Etching

While sputtering offers many advantages, it also has some drawbacks. High-quality sputtering equipment and high-purity target materials are necessary to prevent damage to the silicon wafer or other materials.

Wafer Damage

Without controlled conditions and high-purity sputtering targets, a film can easily form on the wafer, leading to short circuits or irreversible circuit damage.

High Voltage Use

The sputtering process requires high ion energy, making it exhaustively taxing to arrange and execute.

High-Quality Semiconductor Components For Your Devices

Sputtering and etching are crucial processes in fabricating semiconductor devices. This article explored sputtering and its role in the semiconductor industry. Sputter deposition and etching are vital steps in creating high-quality semiconductors and enhancing these devices' efficiency. Despite some drawbacks such as wafer damage and high voltage requirements, the benefits of producing faster, superior products outweigh these concerns.

For further information, please visit more information. Additionally, explore the wide array of products offered by Acetron for your semiconductor sputtering needs.