Rotatable Sputtering Target

Rotary sputtering target technology has been widely used in thin film deposition, especially for large area coating, such as architectural glass and flat panel displays coating manufacturing. The standard manufacturing methods are plasma spraying onto the base tubes, casting, and extrusion of the complete assembly.

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Rotary Target Advantages

Comparing with planar sputtering target , the rotary sputter target contains more material and offers a greater utilization, which means longer production runs and reduced downtime of the system, increases the throughput of the coating equipment. Besides, rotatable targets allow the use of higher power densities due to the heat build-up being spread evenly over the surface area of the target. As a consequence, an increased deposition speed can be seen along with improved performance during reactive sputtering.

Rotary Target Manufacturing Methods

Stanford Advanced Materials provides the custom-made cylindrical rotary sputtering targets, mainly Cr, Ag, Al, Si, Sn, Ti, Stainless steel, TiO2, W, Ta, Mo, Nb, Cu and other metal and alloy materials.

Sprayed: SAM provides thermally sprayed rotary targets providing optimal process stability and performance, including plasma, arc and cold spray production method. The main materials are AZO, ITO, Mo, Si, TiOx, ZnO, and ZTO.

Cast: Main advantages are high compositional and microstructural consistency and purity control, which contribute to high process yield and long target life. Products include InSn, Sn alloys, ZnAl and ZnSn materials.

Extruded: SAM is an established supplier of high-purity extruded Al, Cu, Mo, Nb, Ta, Ti, Zr, V and other materials with good purity and grain size.

HIP/Sintered: HIP products include Cr, Mo, ITO, AZO and ZnO sputtering targets.

Rotary Target Products

Sputtering is a high-speed process where superfast ions hit a sputtering target and dislodge minuscule particles that in turn coat a thin film on substrates like architectural glass, LED televisions and computer displays.

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Rotatable sputtering target, or rotatory target, is a commonly used target shape in magnetron sputtering. It is generally cylindrical, with a stationary magnet inside, and a slow magnetic field, which allows the sputtering rate to be uniform and the target utilization rate to be high. Rotating targets are commonly used for coating solar cells, architectural glass, automotive glass, semiconductors, and flat-panel TVs.

The main advantage of the rotatable target is the high utilization of the target, which means that the rotating target can solve the problem of low utilization of the planar target.

For a planar sputtering target, the target utilization of the normal cathode can reach 25%, and the special design of the magnet bypass with the target back can increase the target utilization to about 40%. Despite this, the utilization of planar targets is still not high. However, the utilization of cylindrical rotating targets is typically in the range of 75% to 90%, much higher than planar targets. However, when the rotating target is used for large-area coating, the uniformity of the surface of the film layer is poor and it is difficult to meet the requirements, which is the biggest disadvantage of the rotating target.

Materials Planar Rotatory Metal Planar molybdenum target, planar copper target, planar titanium target, planar tungsten target, planar zirconia target

 

Rotatory molybdenum target, rotatory copper target, rotatory titanium target, rotatory tungsten target, rotatory zirconia target

 

Oxides Planar SiO2 Sputtering Target Rotatory ATO Sputtering Target, rotary Nb2Ox sputtering target, rotatory TiOx sputtering target, rotatory Al2O3 sputtering target Alloy Planar Cr-Ta sputtering target, planar Ti-Al-Si sputtering target SnO2-Sb2O3 rotatory sputtering target

For more information, please visit https://www.sputtertargets.net/.

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SAM Sputter Targets

Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials. View all posts by SAM Sputter Targets