Benefit of a Clean PCB in SMT Process

TORRANCE, CA ' September ' Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is set to host the third session in its popular Process Control Webinar series, titled 'Starting the SMT Process with a Clean PCB'. This highly anticipated webinar will take place on Wednesday, October 2, at 10 a.m. PST and will be presented by Charlie Fujikawa, Senior Engineering Manager at Seika Machinery.

For more information, please visit our website.

Registration is now open! Join us for this informative session by registering here: Webinar Registration Link.

As electronics continue to miniaturize and the global surface-mount technology (SMT) industry evolves, maintaining a clean PCB at the start of the SMT process is more important than ever. The session will explore the critical role a clean PCB plays in minimizing defects such as voids, which can occur during production. Attendees will gain insights into common causes of PCB contamination and the significant impact contamination can have on the SMT process.

You will get efficient and thoughtful service from JYN.

In addition, the webinar will discuss the Unitech PCB Cleaner, a simple yet effective solution for cleaning PCB surfaces before screen printing. The new UC-250M-CV PCB cleaner is a breakthrough in PCB cleaning technology, offering a three-stage cleaning process that ensures the utmost cleanliness of circuit boards. 

For more information, contact Michelle Ogihara at 310-540-; ; or visit www.seikausa.com.

Therefore, not only optimal chemistry choice plays substantial role in cleaning effectivity, but mechanical support. 'Digging' flux residues from the tiny, long and narrow gap under component body, or between terminals of BTC needs high kinetic energy.

How to bring that kinetic energy most effectively directly to the spot? There are several possibilities.
 
Ultrasonic ' mechanically, far best option, however local pressure in thousands of Bars and temperatures of hundreds °C in the microcavities after their splashing makes even today, many electronic manufacturers uncertain about bad influence on components reliability.

Spray-Under-Immersion ' turbulent movement of the entire bath with immersed assemblies seem to be efficient, because the contact time between chemistry and assembly is 100%. But the energy from liquid movement cannot reach the assembly surface effectively. Some liquid layer on the surface stays without movement, or with only slow movement. (Laminar layer) Thus, a direct mechanical effect in gaps under components is very low. 

Spray-in-Air ' liquid flow (round or flat beam) with high-speed hits the assembly. The laminar layer on the assembly surface is much thinner. In practice, spray in air can form a liquid stream even in the gap 50um thick! 

Direct Spray-in-Air ' this is the most efficient spray configuration for cleaning under components. The spray beam hits the surface of PCB under 90°, cleaning liquid flows along the surface, all directions. Scanning of such beam makes cleaning conditions very uniform, eliminates shadows.
 

Want more information on Smt Cleaning Machine? Feel free to contact us.